IEC 61192-3:2002 pdf download

IEC 61192-3:2002 pdf download.Workmanship requirements forsoldered electronic assemblies -Part 3: Through-hole mount assemblies.
7 Insertion of through-hole components
7.1 General requirements
This subclause covers acceptability requirements for the installation, location, and orientation of components and wires mounted onto printed boards, including both direct mounting to lands and mounting to stand-off terminals.
Criteria are given for only the actual mounting or placement of components or wires on electronic assemblies and to stand-off terminals. Solder is mentioned where it is an integral part of the placement dimensions, but only as related to those dimensions. The condition and amount of solder for connection is covered in clause 8.
The criteria in this subclause are grouped together in five main subsections. Not all combinations of wire/lead types and terminal types can possibly be covered explicitly, so criteria are typically stated in general terms to apply to all similar combinations.
The sequence of topics listed below follows the general sequence of steps for inspection.
Inspection usually starts with a general overall view of the electronic assembly, then follows each component/wire to its connection, concentrating on the lead into the connection, the connection and the tail end of the lead/wire leaving the connection. The wire/lead protrusion step for all lands should be saved for last so that the board can be flipped over and all connections checked together.
Every production facility should have a standard based on how much of each type of contaminant can be tolerated. The more cleaning that has to be done, the more expensive the assembly. Testing with ionic extract devices, insulation resistance tests under environmental conditions and other electrical parameter tests provide a good base for setting a facility standard.
7.3 Missing component
Whenever a component location site is unpopulated in contravention of the approved assemblydrawing this will be a nonconforming condition and a defect for all product levels.
7.4 Wrong component
Whenever a component location site is occupied by any component which differs by type,value, or rating, etc., from that specified by the approved assembly drawing, this will be a non-conforming condition and a defect for all product classes.
7.5 Damaged component
Damage to a component lead or body can arise during installation as well as prior to receipt.This subclause addresses only a small sample of possible damage such as on leads,DlPs,moulded and glass cases.
The following are examples of the more common contaminants found on printed-board assemblies. Others may appear, however, and all abnormal conditions should be evaluated. The conditions represented in this clause apply to both component and secondary sides of the assem blies.
9.1 Flux residues
In order to illustrate an approximate and not necessarily always accurate, analogy between L, M and H type fluxes with the traditional classes of rosin-based fluxes (R, RMA, RA, and RSA), as well as other fluxes such as water soluble or synthetic activated fluxes see IEC 61192-1.