BS EN 62007-1:2009 pdf download

BS EN 62007-1:2009 pdf download.Semi conductor optoelectronic devices for fibre optic system applications一 Part 1: Specification template for essential ratings and characteristics.
5.6 Supplementary information
5.6.1 DC forward current of the laser diode corresponding to .
5.6.2 Response time of the thermistor temperature to the change of cooler current (where appropriate).
5.6,3 Thermal resistance between laser diode junction and case (without cooler): R,hi.c.
5.6.4 . parameter.
5.7 Hazards
See IEC 60825.
6 PIN photodiodes for fibre optic systems or subsystems
6.1 Type
Ambient-rated or case-rated PIN photodiodes with or without optical fibre pigtail for fibre optic systems or subsystems.
6.2 Semiconductor materials Si. Ge, lnGaAs. etc.
6.3 Details of outline and encapsulation
6.3.1 IEC andior national reference number of outline drawing.
6.3.2 Method of encapsulation: glassimetaliplasticiothor.
6.3.3 Terminal identification and indication of any electrical connection between a terminal and the case.
6.3.4 Characteristics of the optical port: relative orientation to mechanical axis, relative position to mechanical axis, area, numerical aperture.
6.3.5 For devices with pigtail: information on the pigtail fibre, type of fibre, kind of protection. connector, length.
6.3.6 Information on the heat sink of the package.
7.2 SemIconductor
7.2.1 MaterIals
Si. Ge, InGaAs. etc.
7.2.2 Structure
7.3 Details of outline and encapsulation
7.3.1 IEC andlor national reference number of outline drawing.
7.3.2 Method of encapsulation: glasslmetallplasticlother.
7.3.3 Terminal identification and indication of any electrical connection between a terminal and the case.
7.3.4 Characteristics of the optical port: relative orientation to the mechanical axes, relative position to mechanical axes, area, numerical aperture.
7.3.5 Information on the pigtail fibre (where appropriate): type of fibre, kind of protection. connector, length.
7.4 LimitIng values (absolute maximum ratings) over the operating temperature range, unless otherwise stated
7.4.1 Minimum bend radius of the pigtail, where appropriate.
7.4.2 MInimum and maximum storage temperature (T319).
7.4.3 Minimum and maximum operating ambient or case temperatures (Tdmb or T).
7.4.4 Maximum soldering temperature (T$Id) (soldering time end minimum distance to case to be specified).
7.4.5 Maximum power dissipation at ambient or case temperature of 25 C (P1w) and derat.ng curve or derating factor.
7.4.6 Maximum pull force for pigtail (fibre or cable), where appropriate, in the direction of the axis of the input pigtail (fibre or cable).
7.4.7 Maximum reverse current (IR).
7.4.8 Maximum forward current (4).
7.5 Electrical and optical characteristics
R shall be the same for all characteristics: It shall be equal to 0,9 of the Individually measured value of r(BR). unless otherwise specified.
7.6.6 Location of sensitive area by reference to the package (without pigtail).
7.6.7 Curve of excess noise factor versus reverse voltage (where appropriate).
7.6.8 Curve of noise current versus reverse voltage (where appropriate).
8 PIN-TIA modules for fibre optic systems or subsystems
8.1 Typ.
Ambient-rated or case-rated PIN-TIA modules for fibre optic systems or subsystems.
The PIN-TIA module consists 01 the following basic parts:
— PIN photodiode:
— TIA circuits;
— fibre pigtail, pigtail connectors, receptacles (connecterized package).
8.2 Semiconductor materials
The PIN-TIA module consists of the following semiconductor materials:
— PIN photodiode: Si, Ge, lnGaAs, etc;
— TIA circuit: GaAs, Si, etc.
8.3 Structure
The structure of the PIN-TIA module is
— PIN photodiode: Mesa, planar, etc;
— TIA circuit: CMOS. Bi-CMOS, HBT. Bi-polar etc;
– information on the fibre coupling: taper type, lens coupling. etc:
— Information on the cireuit: high Impedance, transimpedance. bandwidth. etc.
— information on the package: pigtail. receptacle (connecterized package), etc.
8.4 Details of outline and encapsulation
— IEC andlor national reference number of outline drawing.
— Method of encapsulation: glasslmetal/plaslic/other.
— Terminal identification and indication of any electrical connection between a terminal and the case.
– Characteristics of the optical port: orientation relative to mechanical axis, position relative to mechanical axis, area, numerical aperture.
— Information on the pigtail fibre: type of fibre, kind of protection, connector, length.
— Information on the connectorlreceptacle.
9.3
Structure
Laser diode: gain gulded, index guided, distributed feedback, ridge waveguide, BH, etc.
9.4
Details of outline and encapsulation
IEC and/or national reference number of the outline drawing.
一Method of encapsulation; glass/metal/plastic/other.
Terminal identification and indication of any electrical connection between a terminal and
the case.
Characteristics of the optical port: orientation relative to mechanical axis, position relative
to mechanical axis, area, numerical aperture.
Information on the pigtail fibre: type of fibre, kind of protection, connector, and length.
一Information on the heat sinking of the package.