IEC 61837-2:2000 pdf download
IEC 61837-2:2000 pdf download.Surface mounted piezoelectric devices for frequency control and selection一 Standard outlines and terminal lead connections – Part 2:Ceramic enclosures.
This part 01 lEG 61837 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in ceramic enclosures, and is based on
IEC 61240.
2 Normative references
The following normative documents contain provisions which, through reference in this text, constitute provisions of this pan of EC 61837. For dated references, subsequent amendments to. or revisions of. any of these publications do noi apply. However, parties to agreements based on this part of IEC 61837 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated relenences, the latest edition of the normative document referred to applies. Members of lEG and ISO maintain registers of currently valid International Standards.
I EC 61240:1994. Piezoelectrc do vices — Preparation of outline drawings of surface- mounted devices (SMD) (or frequency control and selection — General rules
3 ConfIguration of enclosures
The enclosures of surfacemounted devices are made of ceramic materials with the terminals of deposited metal film (leadless type) based on Descriptive designation system for semiconductors — Devices package.
The configuration symbols are as shown below.
— DCC (dual Chip carrier);
— 0CC (quad chip carrier).
4 Designation of types
The designation of types is shown on the four parts as follows:
B C I’ [ DID’ I
A: Configuration symbol of enclosures:
— DCC (dual chip carrier):
— 0CC (quad chip carrier).
B: Structure of terminal leads: leadless type has no mark.
C: Number of terminal leads.
D: Serial number of both ligures.
5 Ceramic enclosure dimensions
The dimensions given in this standard apply to all completed SMDdevices for frequency control and selection. Only those dimensions are given which meet the requirements of
IEC 61240.
6 Lead connections
Recommendations for the lead connections of all completed SMD-devices for frequency control and selection are given in the following individual sheets. Lead connections shall always be given in the detail specification.
7 Designation of ceramic enclosures
The following table sets out the designation of the ceramic enclosures, as outlined in the ensuing specification sheets.
