IEEE 1838-2019 pdf download

IEEE 1838-2019 pdf download.IEEE Standard for Test Access Architecture for Three-Dimensional Stacked lntegrated Circuits.
bidirectional terminal: A terminal that can be controlled to switch between driving or receiving signals.
capture event: An event whereby the value present on the cell function input (CFI) or cell functional output (UFO) is stored in a storage element in the shift path.
capture mode: The mode in which all required die-wrapper register (DWR) cells apply the capture event.
For instance, during an external test mode, only the DWR cells attached to die terminal inputs are required to capture. all other die-wrapper register (DWR) cells can apply any event.
cell test input (CTI): A die-wrapper register (DWR) cell’s test data input.
cell test output (CTO): A die-wrapper register (DWR) cell’s test data output.
chip: Active component typically mounted on a board or some other package with other components. It can be a packaged die or die stack (often a user does not need to know whether his/her chip contains one die or multiple dies stacked together). The more general term “component” is normally used in this standard for a compliant object as there may be multiple integrated circuits in a package, even when they behave as a single object. Svn: integrated circuit (IC).
component: An active or passive electronic part. For the sake of this standard, this usually refers to an integrated circuit, although it could include non-integrated-circuit devices mounted on a board. Sec also: chip.
core: A functional circuit design that is part of a single die. In case of non-hierarchical design of the die’s circuitry, all functional circuitry on that die is part of the core. In case of hierarchical design and test architecture of the die’s circuitry, there are multiple embedded cores on a single die, which are assumed to be equipped with an IEEE Std I 50()TM core-test wrapper.
core test: A test methodology that is applied to an embedded core.
dedicated shift path: A shift path comprising storage elements that do not participate in functional operation.
dedicated wrapper (cell): A wrapper style that does not share hardware with core functionality. This style allows certain test operations to occur concurrently and transparently during functional operation. This definition could apply to individual cells.
die: A (typically rectangular) piece of processed semiconductor substrate, containing circuitry. A die is the result of dicing a semiconductor wafer after processing.
die sequence: The first die in the stack is accessible to the outside world. The following dies are referred to as the second, third. etc. The sequence of the dies does not imply any orientation of the dies. A stack can have multiple dies that are last dies; this is called a multi-tower stack.
die stack: A construction in which multiple individual dies are stacked and electrically interconnected, such that together they form a bigger circuit.
die terminal: The physical connection point between dies or between the first die and the interposer or PCB. die-wrapper register (DWR): The register surrounding the die for facilitating die test or die-to-die tests.
external safe state: A configuration of safe register values in which the outputs of a die are in a state that prevents them from interfering with a block of logic outside the die. See also internal safe state; safe state.
EXTEST: This is a shortening of the two words external test.
external test: Occurs when the die-wrapper register (DWR) is used to test logic or interconnect external to the die while the DWR is in outward-facing mode. This may include logic on the die if the DWR cell is not at the die boundary.
falling-edge: A transition from a high to a low logic level. In positive logic, a change from logic 1 to logic 0. Events that are specified to occur on the falling edge of a signal should be completed within a fixed (frequency independent) delay specified by the component supplier.
first die: The first die is the die which is connected to the printed circuit board (PC’B) or an equivalent carrier or interposer. It is typically the bottom die of the stack.
first die external-I/O: Package-level connection to the board or system level.